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conga-TCV2
Modulo COM Express Compact Type 6 con processori AMD Ryzen V2000
Caratteristiche
- COM Express Compact Type 6
- Next gen 7nm SOC
- High performance Zen 2 CPU & VEGA 7 GPU
- Huge scalability with TDP Range from 10-54W
- Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
- AMD Secure Processor with Secure Boot (SME)
Formfactor
COM Express Compact
CPU
AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)
DRAM
Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s
Ethernet
1x 2,5GbE TSN Ethernet via Intel® i225
I/O Interfaces
8 x PCIe Gen3
PEG support x8
2 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs
Graphics
Integrated VEGA 7 graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | HDMI 2.1 | DP 1.4
embedded BIOS Features
OEM Customization
Flash Update
AMI Aptio UEFI
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 5.0 with battery support
Temperature
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
3x DP/HDMI/DP++ | eDP /LVDS
Size
95 x 95 mm (3,74" x 3,74")
