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conga-TEVAL/COMe 3.0

Carrier board di sviluppo per moduli COM Express Type 6 Rev 3.0
Caratteristiche
  1. COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
  2. Reference Carrier Board
Produttore:: Congatec AG

I/O

  • PCI Express x4
  • 5x PCI Express x1
  • PCI Express for Graphics x16
  • M.2 key B size 3042/2260/2280
  • mini PCI Express Half/Full size
  • 4x USB 3.1 Type-A 
  • 2x USB 2.0 Type-A
  • USB Client Type-B
  • Gigabit Ethernet (RJ45) 
  • SDP header

Audio

  • 2x Audio Jack (Line Out/MIC In)
  • Optical S/PDIF Out
  • External Codec header

Storage

  • 4x SATA; SATADOM support
  • SATA Power, SD/SDIO

Misc

  • COM RS-232/422/485
  • COM RS-232
  • CAN Bus
  • Power/Reset/Sleep Buttons
  • 2x FAN
  • Feature header

Video

  • 3x Dual-Mode DiplayPort
  • eDP
  • LVDS
  • VGA

Power

  • ATX 24pin PoweR 
  • 12V Banana 4mm Sockets, CMOS/RTC Battery

Size

  • 294 x 244 mm²

Environment

  • Temperature: Operation: -40° to + 85°C | Storage-40° to + 85°C
  • Humity: Operation: 10% to 90% Storage: 5% to 95%

I/O

  • PCI Express x4
  • 5x PCI Express x1
  • PCI Express for Graphics x16
  • M.2 key B size 3042/2260/2280
  • mini PCI Express Half/Full size
  • 4x USB 3.1 Type-A 
  • 2x USB 2.0 Type-A
  • USB Client Type-B
  • Gigabit Ethernet (RJ45) 
  • SDP header

Audio

  • 2x Audio Jack (Line Out/MIC In)
  • Optical S/PDIF Out
  • External Codec header

Storage

  • 4x SATA; SATADOM support
  • SATA Power, SD/SDIO

Misc

  • COM RS-232/422/485
  • COM RS-232
  • CAN Bus
  • Power/Reset/Sleep Buttons
  • 2x FAN
  • Feature header

Video

  • 3x Dual-Mode DiplayPort
  • eDP
  • LVDS
  • VGA

Power

  • ATX 24pin PoweR 
  • 12V Banana 4mm Sockets, CMOS/RTC Battery

Size

  • 294 x 244 mm²

Environment

  • Temperature: Operation: -40° to + 85°C | Storage-40° to + 85°C
  • Humity: Operation: 10% to 90% Storage: 5% to 95%
Specifiche di prodotto
Standard di riferimento COM Express Type 6
Specifiche di prodotto
Standard di riferimento COM Express Type 6