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TANK-820-H61

Sistema PC embedded fanless espandibile (3 slot) con chipset Intel H61 e processori 2nd gen. Intel Core (Sandy Bridge)

Caratteristiche
  1. Processori 2nd gen. Intel® Core i3 / i5 e Pentium
  2. 2x LAN, 8x COM, 2x USB 3.0, 4x USB 2.0, 8x Digital I/O
  3. Dual Display: VGA, DVI-I
  4. 1x 2.5" SATA HDD/SSD, 1x CompactFlash
  5. 3 slot PCI / PCI Express 
  6. Power input 9-24 VDC
  7. Temperatura Operativa -20° +60° C 
Produttore:: iEi Integration Corp.

Chassis
Color Black C + Silver
Dimensions (WxDxH) (mm) 133 x 269 x 208
System Fan Fanless
Chassis Construction Extruded aluminum alloys
Mounting Wall mount

Motherboard
Processor CPU
Intel® Core™ i5-2xxT (above 2.7 GHz)
Intel® Core™ i3-2xxT (above 2.5 GHz)
Intel® Pentium® G6xxT (above 2.2 GHz)
Chipset Intel® H61

System Memory
On-board DDR3 2 GB memory
1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)

Storage
1 x 2.5'' SATA 3Gb/s HDD/SSD bay
1 x CF Type II

I/O Interfaces
2x USB 3.0
4x USB 2.0
2x Ethernet RJ-45 PCIe GbE by Realtek 8111E
4x RS-232 DB-9 (two with isolation)
2x RS-422/485 RJ-45
8-bit digital I/O, 4-bit input/4-bit output
1 x Line-out, 1 x Mic-in

Display
1 x VGA, 1 x DVI-I
Resolution
VGA: Up to 2048 x 1536@75Hz
DVI-I: Up to 1920 x 1080@60Hz

Expansions
2PIE versions: 2x PCI + 1x PCI Express 8x slot
1P2E versions: 1x PCI + 1x PCI Express 1x + 1x PCI Express 8x

Power
Power Input Terminal Block: 9 V~24 V DC
DC Jack: 9 V~24 V DC
Power Consumption 19 V@3.5 A (Intel® Core™ i3-2100 with 6 GB DDR3 memory) w/o add-on card

Reliability
Operating Temp. -20°C ~ 60°C with air flow (SSD), 5% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operating Vibration MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net/Gross) 4.2 kg/6.3 kg
Safety/EMC CE/FCC

OS
Supported OS Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® XP Embedded

Chassis
Color Black C + Silver
Dimensions (WxDxH) (mm) 133 x 269 x 208
System Fan Fanless
Chassis Construction Extruded aluminum alloys
Mounting Wall mount

Motherboard
Processor CPU
Intel® Core™ i5-2xxT (above 2.7 GHz)
Intel® Core™ i3-2xxT (above 2.5 GHz)
Intel® Pentium® G6xxT (above 2.2 GHz)
Chipset Intel® H61

System Memory
On-board DDR3 2 GB memory
1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)

Storage
1 x 2.5'' SATA 3Gb/s HDD/SSD bay
1 x CF Type II

I/O Interfaces
2x USB 3.0
4x USB 2.0
2x Ethernet RJ-45 PCIe GbE by Realtek 8111E
4x RS-232 DB-9 (two with isolation)
2x RS-422/485 RJ-45
8-bit digital I/O, 4-bit input/4-bit output
1 x Line-out, 1 x Mic-in

Display
1 x VGA, 1 x DVI-I
Resolution
VGA: Up to 2048 x 1536@75Hz
DVI-I: Up to 1920 x 1080@60Hz

Expansions
2PIE versions: 2x PCI + 1x PCI Express 8x slot
1P2E versions: 1x PCI + 1x PCI Express 1x + 1x PCI Express 8x

Power
Power Input Terminal Block: 9 V~24 V DC
DC Jack: 9 V~24 V DC
Power Consumption 19 V@3.5 A (Intel® Core™ i3-2100 with 6 GB DDR3 memory) w/o add-on card

Reliability
Operating Temp. -20°C ~ 60°C with air flow (SSD), 5% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operating Vibration MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net/Gross) 4.2 kg/6.3 kg
Safety/EMC CE/FCC

OS
Supported OS Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® XP Embedded

Specifiche di prodotto
Famiglia CPU 2nd gen. Intel Core (Sandy Bridge)
Porte Seriali / COM 6
Porte USB 6
digital I/O 8 DIO
Porte Ethernet 2
N. Display supportati 2
Uscite Video VGA
Uscite Video DVI-I
Power In 9-24 VDC
Temperatura operativa (Max) -20° +60° C
Slot PCI / PCI Express 3x PCI / PCIe
Specifiche di prodotto
Famiglia CPU 2nd gen. Intel Core (Sandy Bridge)
Porte Seriali / COM 6
Porte USB 6
digital I/O 8 DIO
Porte Ethernet 2
N. Display supportati 2
Uscite Video VGA
Uscite Video DVI-I
Power In 9-24 VDC
Temperatura operativa (Max) -20° +60° C
Slot PCI / PCI Express 3x PCI / PCIe